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Bare Board Defect Recognition

 

COURSE DESCRIPTION:

The purpose of this training is to teach assembly operators how to recognize defects on bare circuit boards. These include defects in the base material; solder mask problems; damage or contamination on gold fingers; damage to traces or lands; and marking defects.

COURSE OBJECTIVE:

 Upon satisfactory completion of this course, students will have a better understanding of the possible Bare Board Defects that can be detected on the surface of the PCB before component placement.

 

COURSE TOPICS:
1. Edge Delamination

2. Burr

3. Plating Void on Conductor Trace

4. Marking on Land

5. Solder Mask Misregistration

6. Plating Overlap on Gold Fingers

7. Measles

8. Conductor to Land Junction

9. Solder Mask Cracking / Wrinkling

10. Delamination

11. Pit on Gold Finger

12. Minimum Annular Ring

13. Whisker

14. Nodule

15. Solder Mask Blister

16. Marking Ink into PTH

17. Hole to Land Misregistration

18. Scratched Conductors

19. Solder Mask Skips

20. Illegible Marking

 

EVALUATION: Inspection, Hands - On practice
Written examination & evaluation of students inspection.
70% or above needed for certificate

CERTIFICATE: Certificate presented to those passing the evaluation.

PREREQUISITES: None