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IPC-A-610 Acceptability of Electronic Assemblies

Certified IPC Specialist (Up to 24 hours depending on your needs)

 

COURSE DESCRIPTION:

Acceptability of Electronic Assemblies Training teaches the Accept/Reject criteria for the Electronic Assembly Industry.  The IPC-A-610 is the most widely used electronics assembly standard in the world.  It is ANSI approved.  It is DoD adopted.

This class also covers LEAD-FREE acceptance criteria.

 

COURSE OBJECTIVE:

Upon satisfactory completion of this course, participants will be able to make correct “Accept/Reject” decisions for the appropriate class/classes of production, based on the acceptability requirements of the IPC-A-610.

 

Candidates will take one closed book exam and one open book exam for Module 1 & 2. Modules 3-9 each have one open book exam. Student must score 70% or better on the exams for certification.  Candidates who are successful will receive the IPC industry recognized Certified IPC Specialist certificate.

 

COURSE TOPICS:

Module 1:  Introduction/IPC Professional Training and Certification Policies and Procedures

 

Teach methods and techniques to use, navigate, locate and apply the criteria contained in the IPC-A-610 to the appropriate class or classes of production.

 

Module 2:  Forward, Applicable Documents, & Handling

Scope

Purpose

Specialized Designs

Terms & Definitions

Examples and Illustrations

Inspection Methodology

Verification of Dimensions

Magnification Aids and Lighting

Applicable Documents

Handling Electronic Assemblies

 

Module 2 also defines the three classes of Electronic Assembly Products as follows:

Class 1:  General Electronic Products

Class 2:  Dedicated Service Electronic Products

Class 3:  High Performance Electronic Products

 

Upon completion of Module 2, the participant will have a common understanding of the IPC-A-610 document, terms and definitions, and handling considerations.

 

Module 3:  Hardware

This Module teaches the Acceptance criteria for the following:

Hardware Installation

Connectors, Handles, Extractors, Latches

Connector Pins

Wire Bundle Securing

Routing

 

This section also illustrates several types of hardware used to mount electronic devices such as:  screws, bolts, nuts, washers, fasteners, clips, component studs, tie downs, rivets, connector pins, etc.  Primarily focusing on the visual assessment of proper securing (tightness) and damage to the devices, hardware, and the mounting surfaces.

Upon completion of Module 3, the participant will be able to identify acceptable mechanical assembly requirements.

 

Module 4:  Soldering

This Module teaches the Industry Acceptance Standard for visual inspection of Soldered Connections.

Soldering Acceptability Requirements

Soldering Anomalies

Primary differences between the solder connections created using tin-lead alloys or lead free alloys.

 

Upon completion of Module 4, the participant will be able to identify the acceptability requirements for soldered assemblies and soldered connections.

 

Module 5:  Terminal Connections

This Module teaches the Acceptance criteria for the following:

Swaged Hardware

Wire/Lead Preparation, Tinning

Lead Forming – Stress Relief

Service Loops

Stress Relief Lead/Wire Bend

Lead/Wire Placement

Insulation

Conductor

Terminals – Solder

Conductor – Damage – Post-Solder

Edge Clip

 

Upon completion of Module 5, the participant will be able to identify the requirements for Terminal connections.

 

 

 

Module 6:  Through-Hole Technology

This Module teaches the Acceptance criteria for the following:

Component Mounting

Heatsinks

Component Securing

Unsupported Holes

Supported Holes

Jumper Wires

 

Upon completion of Module 6, the participant will be able to recognize the acceptability requirements for through-hole component mounting and jumper wires.

 

Module 7:  Surface Mount Assemblies

This Module teaches the Acceptance criteria for the following:

Staking Adhesive

SMT Connections

Chip Components – Bottom Only Terminations

Chip Components – Rectangular or Square End Components – 1, 3, or Side Termination

Cylindrical End Cap Termination

Castellated Terminations

Flat Ribbon, L, and Gull Wing Leads

Round or Flattened (Coined) Leads

J Leads

Butt/I Joints

Flat Lug Leads

Tall Profile Components Having Bottom Only Terminations

Inward Formed l-Shaped Ribbon Leads

Plastic BGA

Plastic Quad Flat Pack-No Leads (PQFN)

Components with Bottom Thermal Plane Terminations (D-Pak)

Jumper Wires

Upon completion of Module 7, the participant will be able to recognize and apply the criteria for Surface Mount Assembles and Jumper Wires.

 

Module 8:  Printed Circuit Boards and Assemblies & Component Damage

This Module teaches the Acceptance criteria for the following:

Printed Circuit Boards and Assemblies

Gold Fingers

Laminate Conditions

Marking

Cleanliness

Coatings

Component Damage

Upon completion of Module 8, the participant will be able to recognize and apply the criteria for printed circuit board assemblies and component damage.

Module 9:  Solderless Wrap

This Module teaches the Acceptance criteria for Solderless Wrap.  This includes the following:

Number of Turns

Turn Spacing

End Tails, Insulation Wrap

Raised Turns Overlap

Connection Position

Wire Dress

Wire Slack

Wire Plating

Damaged Insulation

Damaged Conductors & Terminals

 

Upon completion of Module 9, the participant will be able to recognize the acceptability requirements for discrete wiring.

 

EVALUATION:  Open and closed book tests.  A score of 70% or above is needed for certification.

 

CERTIFICATE:  2 year Certification

 

PREREQUISITES:  None